Thermal Conductive Adhesive
Applications
Bonding of heat sink for PCB and IC packages
Mounting of IC, GPU, heat pipes, and heat sinks
Heat transferring applications in electronic and electric appliances
Construction
| Unit of Measure | Result | Test/Spec | |
|---|---|---|---|
| Base Material | Glass Fiber | ||
| Color | White | ||
| Thickness | mm | 0.100 +/- 10% | |
| Thermally Conductive | |||
| Acrylic Adhesive | mm | 0.15 +/- 10% | 1mm/1000mm Thickness Dial Gage/Mitutoyo 7313 |
| Total Thickness | mm | 0.25 +/- 10% | |
| Tensile Strength | kg/10mm | 0.16 | |
| Elongation | % | 550 | |
| Shear Adhesion | kg/cm2 | 3.5 | |
| Adhesive Power | |||
| (1800 Peel, gf/26mm) | 1000 | PET Film (25µm)/min SUS 304 Plate | |
| Holding Power | sec | More than 3600 | PET Film (25µm), 400C, 500g |
| Dielectric Breakdown | kV | 4 | |
| Thermal Impedance | |||
| Coefficient | 0C-in2/W | 0.7 | ASTMD5470 |
| Thermal Conductivity | W/m-K | 1 | ASTMD5470 |
Notes
- Adhesive is stored in a clean and dust-free environment with a temperature range of 20~250C without any direct sunlight.
- No load bearing onto adhesive.
- To obtain optimum adhesion, the bonding surface should be clean, dry, and well unified.